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Self-aligned deep trench process for light weight MEMS mirrrors
Students: Lei Wu

Sponsor(s): NSF, Florida Photonics Center of Excellence

 

Objectives

          Develop a novel self-aligned deep trench process enabling the fabrication of large aperture size electrothermal MEMS mirrors with light weight mirror plate and wider actuation bimorph beams.

Technical Approach

          Novel process featuring self-aligned patterning in deep trench of Si Wafer

          Si DRIE based bulk micromachining

Accomplishment

          Demonstrated the fabrication of a trial version light weight mirror with 3mm aperture size

Applications:

          Agile scanning mirror of large aperture size by significantly reduced mirror mass and stiffer actuation beams.

          Improving temperature uniformity by the wider bimorph beams

          Increasing the convection on the mirror surface for faster thermal response

 

 

 

Biophotonics & Microsystems Lab, 136 Larsen Hall, PO Box 116200, Gainesville, FL 32611-6200.

Phone : (352) 392-1049         Fax : (352) 846-1416

 
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