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Self-aligned deep
trench process for light weight MEMS mirrrors
Objectives • Develop a novel self-aligned deep trench process enabling the fabrication of large aperture size electrothermal MEMS mirrors with light weight mirror plate and wider actuation bimorph beams. Technical Approach • Novel process featuring self-aligned patterning in deep trench of Si Wafer • Si DRIE based bulk micromachining Accomplishment • Demonstrated the fabrication of a trial version light weight mirror with 3mm aperture size Applications: • Agile scanning mirror of large aperture size by significantly reduced mirror mass and stiffer actuation beams. • Improving temperature uniformity by the wider bimorph beams • Increasing the convection on the mirror surface for faster thermal response
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Biophotonics & Microsystems Lab, 136 Larsen Hall, PO Box 116200, Gainesville, FL 32611-6200. Phone : (352) 392-1049 Fax : (352) 846-1416 |
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