Biophotonics & Microsystems Laboratory
Flip-chip Bonding of MEMS micromirrors for High-Fill-Factor Applications
Students: Andrea Pais,
University of Florida
Advisor: Huikai Xie, University of Florida
Sponsor(s): AFRL
Objectives
• Develop a flip-chip approach to bond MEMS micromirrors to a substrate for high-fill-factor mirror/mirror array applications.
• Electroplate
Copper spacers ~15 um thick to protect the thin-film MEMS structures.
Technical Approach
•
Use photolithography and electroplating
processes to pattern 15 um tall copper pillars on a substrate.
• Electroplate
Indium over the copper pillars. substrate and lift-off the copper and PR.
• Use flip-chip bonding to bond the Micromirror/ micromirror array to the wiring substrate.
Accomplishment
• Sucessfully electroplated the copper spacers and indium bonding solder over the spacers on test substrates to test the precision of the process.
• Bonded
mirror structure to substrate using Flip-chip Bonding.
Applications:
• Beam Steering and optical phased arrays.
• Micro-FTIR spectroscopy (Team up with compact high-power IR laser source and uncooled IR detector efforts)
• Portable, inexpensive sensors (Explosives, toxin gases, bio-agents, etc.
Biophotonics & Microsystems Lab, 136 Larsen Hall, PO Box 116200, Gainesville, FL 32611-6200.
Phone : (352) 392-1049 Fax : (352) 846-1416
