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Monolithic Integrated CMOS-MEMS DC-DC Converter
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In the project of Power
CMOS-MEMS DC-DC converter, we are going to integrate high‑power density
inductors, transformers, capacitors and power MOSFET into a monolithic CMOS
chip by using post-CMOS process. To increase the power density and reduce
the loss, the coils of inductors and transformers are fabricated by
electroplating metals in silicon molds, which increase the thickness of
coils and reduce the resistance. The core loss is reduced by using high
resistance magnetic material and core lamination.
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(a) 180μm
thick copper in high-aspect-ratio silicon trench
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(b) Released 180μm
thick coils |
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Related Paper:
MINGLIANG WANG, KHAI D.T. NGO, ISSA
BATARSEH, and HUIKAI XIE, "INTEGRATED
POWER INDUCTOR WITH SILICON SUBSTRATE MOLDING," APCOT, June 2006.
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Biophotonics & Microsystems Lab, 136 Larsen Hall, PO Box 116200, Gainesville, FL 32611-6200.
Phone : (352) 392-1049 Fax : (352) 846-1416 |
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